How to Choose High-Speed Board-to-Board & Backplane Connectors: Complete Guide for 2024
2024-11-22
Blog
Richmon
Quick Selection Guide: High-Speed Connector Specifications
Speed Class | Recommended Type | Key Specifications | Typical Applications | Cost-Performance Ratio |
---|---|---|---|---|
Basic (Up to 28 Gbps) | Standard PCIe | – Insertion loss: -3dB max – Crosstalk: -40dB min – Impedance: 100Ω ±10% | Enterprise servers, Storage systems | Cost-effective |
Advanced (28-56 Gbps) | High-Performance PCIe | – Insertion loss: -2dB max – Crosstalk: -50dB min – Impedance: 100Ω ±5% | Data centers, High-end computing | Moderate |
Premium (56+ Gbps) | Advanced Backplane | – Insertion loss: -1dB max – Crosstalk: -60dB min – Impedance: 100Ω ±3% | Telecommunications, AI/ML systems | Premium |
Table of Contents
Understanding Your Requirements
The global backplane market has reached an unprecedented $15 billion in 2023, according to MarketsandMarkets. This remarkable growth reflects the increasing demands of modern electronic systems, particularly in data centers and telecommunications infrastructure.
Market Dynamics Influencing Connector Selection
- Data Center Evolution: The shift toward higher data processing speeds requires connectors supporting 56 Gbps and beyond.
- 5G Infrastructure: Telecommunications equipment demands ultra-high-speed backplane solutions.
- AI/ML Applications: Artificial intelligence and machine learning systems need superior signal integrity.
- Edge Computing: Distributed computing architectures require reliable high-speed connections.
Critical Requirements Analysis
Before selecting a high-speed connector, consider these essential factors in your system design:
Data Speed Requirements
- Current data rate needs
- Future bandwidth projections
- Protocol compatibility (PCIe, Ethernet, etc.)
- Latency requirements
Physical Constraints
- Board space availability
- Mounting requirements
- Airflow considerations
- Component clearance needs
Environmental Considerations
- Operating temperature range
- Humidity tolerance
- Shock and vibration resistance
- Industrial grade requirements
Critical Selection Factors
Selecting the right high-speed connector requires careful consideration of multiple technical parameters. Our server applications guide provides detailed insights into these critical factors.
Signal Integrity Specifications
Insertion Loss
- Optimal: < -1dB at Nyquist frequency
- Acceptable: < -3dB at Nyquist frequency
- Impact: Direct effect on signal quality
- Measurement: Vector Network Analyzer (VNA)
Return Loss
- Optimal: < -20dB across frequency range
- Acceptable: < -15dB across frequency range
- Impact: Signal reflection minimization
- Consideration: Impedance matching crucial
Crosstalk Performance
- Near-end (NEXT): < -60dB
- Far-end (FEXT): < -50dB
- Impact: Signal interference prevention
- Solution: Advanced shielding techniques
Types of High-Speed Connectors

Explore our comprehensive connector solutions designed for various high-speed applications.
PCIe Connectors
- Gen 5.0 Capabilities:
- Data rates up to 32 GT/s
- Enhanced signal integrity
- Backward compatibility
- Optimized power delivery
- Applications:
- Server systems
- Storage arrays
- Graphics processing
- AI accelerators
Backplane Connectors
- High-Speed Features:
- 112+ Gbps capability
- Dense pin configurations
- Superior EMI shielding
- Robust mechanical design
- Best For:
- Telecommunications
- Data center infrastructure
- Industrial automation
- Network switches

Common Challenges and Solutions
According to Electronic Design, signal integrity issues remain one of the primary challenges in high-speed connector applications. Here’s a comprehensive guide to addressing these challenges:
Signal Integrity Issues
Challenges:
- Signal degradation at high frequencies
- EMI susceptibility
- Impedance mismatches
Solutions:
- Advanced shielding techniques
- Optimized pin assignments
- Controlled impedance design
Thermal Management
Challenges:
- Heat dissipation in dense designs
- Temperature-related performance drift
- Material limitations
Solutions:
- Enhanced airflow designs
- Advanced thermal materials
- Optimized power distribution
Testing and Validation
According to EDN Network, comprehensive testing is crucial for ensuring reliable high-speed connector performance. Here’s a detailed testing framework based on industry standards:
Essential Testing Parameters
Electrical Testing
- Signal Integrity:
- Eye diagram analysis
- S-parameter measurements
- Impedance profiling
- Crosstalk evaluation
- Power Integrity:
- Current carrying capacity
- Voltage drop measurement
- Power distribution analysis
Mechanical Testing
- Durability:
- Mating cycles: 250+ minimum
- Contact resistance stability
- Insertion/extraction force
- Environmental:
- Temperature cycling
- Humidity resistance
- Shock and vibration
Future-Proofing Your Selection
The connector industry continues to evolve rapidly. Based on research from Grand View Research, here are key trends shaping the future of high-speed connectors:
Emerging Technologies and Trends
Speed Evolution
- 112 Gbps PAM4 becoming standard
- 224 Gbps on the horizon
- Advanced signal processing integration
Design Innovations
- Miniaturization advances
- Novel material developments
- Integrated cooling solutions
Industry Requirements
- Enhanced power efficiency
- Improved thermal management
- Greater design flexibility
Making Your Final Decision
Comprehensive Selection Checklist
Factor | Considerations | Priority Level |
---|---|---|
Performance Requirements |
| Critical |
Physical Constraints |
| High |
Cost Considerations |
| Medium |
Ready to Optimize Your High-Speed Connectivity?
Trust Richmon’s expertise in high-speed connector solutions. Our engineering team is ready to help you:
- Select the optimal connector for your application
- Ensure compliance with industry standards
- Maximize system performance
- Reduce implementation challenges
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